Samsung's in-house smartphone chips are often criticized for overheating and consuming more power than rival chips. Over the past couple of years, Samsung has largely solved those issues. Its most recent chip, the Exynos 2600, uses a new technology called Heat Path Block (HPB) for improved heat dissipation. In the future, it could use one more technology to further improve heat dissipation.
Current Exynos chips use a Fan-Out Wafer Level Package (FOWLP) structure, which places input and output terminals outside the chip to reduce heat generation inside the chip. Moreover, it also uses the HPB, which is a thin copper layer that helps dissipate the processor's heat faster. However, the DRAM and the HPB are both placed on top of the processor, which means the HPB can only dissipate heat generated by the processor and not the DRAM.